深圳斯普瑞溙科技有限公司是一家專業(yè)從事半導體后道封裝測試貼片及邦定工藝相關耗材、測試工藝耗材及治具、封裝測試設備備件的研發(fā)設計、生產、銷售于一體的企業(yè)。公司成立于2009年。
     公司擁有一個半導體制造技術經驗豐富的團隊，不定期地與國外進行技術交流，不斷地進行新技術、新工藝的開發(fā)和改進，使公司在半導體封裝測試工藝日新月異的變化中發(fā)展壯大，技術得到積累和提升。隨著半導體封裝測試加工向超薄，超小的方向發(fā)展，對相關的輔助工裝治具及工藝的要求越來越高，公司通過使用新的材料，研發(fā)設計革新相關輔助治具，提出工藝改進建議，與客戶一起攜手解決遇到的技術難題，使客戶在低成本，高效率中贏得市場，達到雙贏效果。
      公司憑借優(yōu)秀的技術團隊，高品質的產品，準時的交貨，優(yōu)質的客戶服務，合理的價格，已經與諸多的國際，國內的IC封裝廠商建立了長期的合作關系，贏得了客戶的認可。
我們提供的產品及服務如下:
1)貼片及邦定工藝耗材：陶瓷吸嘴，常溫橡膠吸嘴，高溫橡膠吸嘴，電木吸嘴，引線框架吸嘴，頂針，點膠頭，點膠針，打火桿。
2）測試工業(yè)耗材及治具：各種封裝系類的測試爪/片（QFN,DFN,SOP,DIP,SOT,SOD,TO-XXX),測試座及POGO PIN,(BGA,QFN,DFN,QFP,FLIP CHIP)
3)封裝測試設備備件（ISMECA,ASM,ESEC,OE,MUHLBAUER)  
公司網址/  

  Shenzhen Springtech Technology Co., Ltd ,founded in 2009,is a professional supplier of semiconductor assembly and test tooling parts . Our main areas of focus are die bond , wire bond ,testing processes and the related equipment spare parts . We have our own capability in design , manufacturing and assembly in the various fields of the Semiconductor Industry .  

  Springtech has a team of people with rich experience in semiconductor manufacturing . As a technology company , we recognize the importance of technique and innovation . Therefore we place a high priority in areas of co-operation with overseas partners and embrace new technology , process development moving towards smaller and thinner devices , it is a great challenge for the related manufacturing tools . We are ready to take on these challenges and provide solutions using our core techniques , new materials and process development . In short .we hope to help our customers achieve their targets efficiently with low cost and high quality , enabling all parties to be in a win-win situation .
   With our continuous efforts to pursue technique innovation , high quality , on-time delivery , customer satisfaction with competitive pricing , we managed to establish long-term co-operation with many IC assembly companies, gaining a soild reputation and recogntion from the industry.

Range of products/services:
1.Die Bond/Wire Bond tooling:
 - Ceramic collect tip , rubber tip , high temperature rubber tip , Vespel tip , Lead Frame suction cup , Die ejector needle , Epoxy dispensing nozzles , EFO body .
2.Testing tools:
 - (for all package types)Contact Fingers , pogo pin , test socket.
3.Spare parts :
 - Machine spare parts for ISMECA , ASM , SRM , ESEC , OE , MUHLBAUER and more.